Advanced Wirebond Interconnection Technology

Description

Advanced Wirebond Interconnection Technology

 

Publisher:   Springer
Number Of Pages:   704
Publication Date:   2004-04-30
Sales Rank:   540670
ISBN / ASIN:   1402077629
EAN:   9781402077623
Binding:   Hardcover
Manufacturer:   Springer
Studio:   Springer

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.
A CD-ROM is included, which contains 2D and 3D animations of many concepts that are discussed in this book. The animations with voice-overs help the reader grasp the ideas faster with visual experience, which leads to better retention.

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