Bonding in Microsystem Technology (Springer Series in Advanced Microelectronics)

Description

Bonding in Microsystem Technology (Springer Series in Advanced Microelectronics)

 

By Jan A. Dziuban

Publisher:   Springer
Number Of Pages:   331
Publication Date:   2006-07-26
Sales Rank:   1009170
ISBN / ASIN:   1402045786
EAN:   9781402045783
Binding:   Hardcover
Manufacturer:   Springer
Studio:   Springer

Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, µTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching. Such structures cannot be used directly, they must be designed and fabricated as a part of the three – dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in microsystems followed by the detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique.

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Following this, presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.

Bonding in Microsystem Technology is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. It can serve as the encyclopaedia of wet etching and bonding for microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. The book contains a large number of illustrations, algorithmic flow-charts and microsystems description and a rich index of literature sources.

http://mihd.net/7jh8rl

http://rapidshare.com/files/45218942/Bonding_in_Microsystem_Technology.rar

 

Disclaimer:
Contents of this page are indexed from the Internet. All actions are under your responsability. Email us to report illegal contents or external links and we'll remove them immediately.

Please check the description for download links if any or do a search to find alternative books.

Can't Download?
Please search mirrors if you can't find download links for "Bonding in Microsystem Technology (Springer Series in Advanced Microelectronics)" in "Description" and someone else may update the links. Check the comments when back to find any updates.

Search Mirrors
Maybe some mirror pages will be helpful, search this book at top of this page or click here to find more info.

1. Ebooks list page : 1163
2. Technology of Integrated Circuits (Springer Series in Advanced Microelectronics)
3. Gettering Defects in Semiconductors (Springer Series in Advanced Microelectronics)
4. Highly Sensitive Optical Receivers (Springer Series in Advanced Microelectronics)
5. Detection and Signal Processing: Technical Realization (Springer Series in Advanced Microelectronics
6. Microsystem Technology
7. Advances in Design (Springer Series in Advanced Manufacturing)
8. Advances in Design (Springer Series in Advanced Manufacturing)
9. Dielectric Films for Advanced Microelectronics
10. [request_ebook] Sun Certified Enterprise Architect for J2EE Technology Study Guide
11. Third Generation Photovoltaics: Advanced Solar Energy Conversion (Springer Series in Photonics) by Martin A. Green
12. Laser Resonators and Beam Propagation : Fundamentals, Advanced Concepts and Applications (Springer Series in Optical Sciences)
13. Third Generation Photovoltaics: Advanced Solar Energy Conversion (Springer Series in Photonics) by Martin A. Green (Repost)
14. Field-Based Coordination for Pervasive Multiagent Systems (Springer Series on Agent Technology)
15. Adhesive Bonding: Science, Technology and Applications
16. Optical Spectra and Chemical Bonding in Transition Metal Complexes: Special Volume II (Structure and Bonding 107)