Materials for Information Technology: Devices, Interconnects and Packaging

Description

Publisher: Springer
Language: English
ISBN: 1852339411
Paperback: 527 pages
Data: Oct 2005
Format: PDF
Description: The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications.

Included are:
materials for silicon-based semiconductor devices (including high-k gate dielectric materials);
materials for nonvolatile memories;
materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and
materials for assembly and packaging
The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.

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