Microvias: For Low Cost, High Density Interconnects
ISBN: 0071363270
Category: Technical
Tag: Science/Engineering
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John H. Lau, S.W. Ricky Lee , "Microvias: For Low Cost, High Density Interconnects"
McGraw-Hill Professional; 1 edition (April 26, 2001) | ISBN: 0071363270 | 565 pages | PDF | 11 Mb
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McGraw-Hill Professional; 1 edition (April 26, 2001) | ISBN: 0071363270 | 565 pages | PDF | 11 Mb
Mirror -> FileFactory
MIRROR : IceFile.com
From me to you: http://rapidshare.com/files/67991497/MFLC.rar
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